BGA, uBGA, CSP, oddform, 0402, 0201, 01005 Assembly,Contract Electronic Manufacturing Services,SMT, automatic insertion, hand assembly & high level ssembly,Rapid new product introduction assembly,IPC/BSI certified RoHS compliant soldering processes.
Advanced Manufacturing Services
Technologies and Capabilities Include:
# 0402 and 0201 package types
# Chip Scale Package (CSP)
# BGA and uBGA double-sided/mirrored BGA assembly
# COB and MCM
# Direct and multiple chip attach
# High pin count press fit
# Gold and aluminum wedge-bonding
# Wire-bonding
# Flex Circuits
# Wave solder
# Selective soldering
# Aqueous cleaning

QFN and BGA board Assembly
0201,0402 package PCB Assembly
Immersion Gold PCB 0201
Immersion Gold PCB, BGA/0201
Immersion silver PCB,BGA/0402
Laser stencil(use for BGA and 0201,0402)
Normal stencil(use for 0805,1206 package)
This Photo is From Microscope, 100x
QFN&QFP 0201,0402 board
QFN&QFP 0201,0402 board
QFN&QFP 0201,0402 board
Thru hole wave soldering
Thru hole wave soldering
SMT Assembly
QFN&QFP 0201,0402 board
SMT Assembly
Click to see More Photos: SMT Pick and Place Machine Line

Our advantage: Sr. Engineer will go through the whole process: Design - component procure - PCB Fabrication - Assembly, we can make High Quality Data work, High Quality component,High Quality PCB, High Quality Assembly, and with these effort will come out High grade and reliable product.